Benefiting from the gradual increase in the trend of chip miniaturization, the development space of the wafer cutting UV film market continues to expand

Wafer cutting refers to an important part of the chip manufacturing process. It refers to the process of dividing the entire wafer of the chip into individual chips (grains) according to the chip size. The main steps include film attaching, cutting, degluing, etc. Wafer cutting UV film is a key film material used in the film-laying step in the wafer cutting process. It is mainly used to fix the back of the wafer on the metal mold frame to fix the wafer so that the wafer will not die after cutting. Will scatter.

Currently, there are two main types of film materials used in the film-laying step of the wafer cutting process, namely blue film and UV film (ultraviolet irradiation tape). Among them, the adhesive strength of UV film is variable, the adhesion is strong, but the adhesion will be reduced after ultraviolet irradiation, it is easy to peel off and has no residue, the cost is relatively high, and it is more suitable for wafer cutting scenarios of small-size chips; The cost of blue film is lower, about 1/3 of the cost of UV film, but its viscosity is not variable, it is difficult to remove the film and prone to residual glue. It is more suitable for wafer cutting scenarios of large-size chips.

According to the “2023-2028 Wafer Cutting UV Film Industry Market In-depth Research and Investment Prospect Forecast Analysis Report” released by the Industrial Research Center It shows that chips are core components of various electronic devices and are widely used in consumer electronics, home appliances, automobiles, industrial automation, rail transit, medical instruments, intelligent robots and other fields. As downstream electronic equipment continues to develop towards high performance, low energy consumption, and low cost, chips, as their core components, are being continuously upgraded in the direction of miniaturization and high precision to meet market requirements. In the future, as chips become increasingly miniaturized, the market demand for wafer cutting UV film will continue to increase, and it is expected to replace wafer cutting blue film and become the mainstream product in the wafer cutting film material market. The industry has huge development potential.

From the production side, wafer cutting UV film is generally composed of two to three layers of materials, including base material PET, PVC, EVA film base material, etc., middle adhesive layer material UV adhesive, and coating layer material special formula paint. The production of wafer cutting UV film requires a lot of materials and is difficult to produce. Due to technical limitations, my country’s industry started late.

At present, the number of companies in the domestic wafer cutting UV film market is still relatively small. They mainly include Jiangsu Kanghui New Material Technology, Taizhou Haofeng Electronic Technology, Suzhou Qianhui Semiconductor, Changzhou Xinlun Electronic Materials, Suzhou Saiwu Application Technology, and Shenzhen Xinlun. Technology, Guangdong Hongqing Electronic Materials, etc. In the future, local companies will need to continue to improve their technical levels and increase technology research and development efforts, which will in turn accelerate the development of the domestic wafer cutting UV film industry.

Industrial analysts said that wafer cutting UV film is an important film material required in the chip manufacturing process. In recent years, against the background of the continuous upgrading of domestic chips in the direction of miniaturization, their market demand has continued to increase, and the industry has shown good development prospects. Due to technical limitations, the number of companies entering the wafer cutting UV film market in my country is currently relatively small, and there is still much room for local companies to grow in the future.