The market demand for underfill glue continues to grow, and there are a large number of companies with global presence.

Underfill glue (Underfill glue), also known as underfill agent and underfill, refers to a thermosetting one-component, modified epoxy resin glue. Underfill glue is mainly used in the circuit board assembly of high-end electronic products such as mobile phones, computer motherboards, MP4, digital cameras, etc., for the underfill process of BGA (Ball Grid Array Package), CSP (Chip Scale Package) and Flip Chip (Stacked Package) , underfill glue can form a strong filling layer, thereby effectively reducing the stress impact caused by the difference in thermal expansion coefficient between the chip and the substrate. It is an important electronic adhesive for integrated circuit packaging.

The working principle of underfill glue is to use capillary action to fill the glue into the bottom of the BGA chip, and fix the BGA chip on the substrate after heating, thereby improving the structural strength and reliability of the component and enhancing the resistance between the BGA package mode chip and the PCBA. drop performance purposes. According to different application scenarios, underfill can be divided into flip-chip underfill, flip-chip film underfill, ball grid array underfill, etc.

According to the “2023-2028 Underfill Glue (Underfill Glue) Industry Market In-depth Research and Investment Prospects Forecast Analysis Report” released by the Industrial Research Center shows that in recent years, against the backdrop of the gradual development of mobile phones, computers and other portable electronic products in the direction of miniaturization, miniaturization and thinness, the increasing penetration rate of the CSP/BGA market has prompted the continuous improvement of related packaging process requirements. As an important type of packaging electronic adhesive, the market demand for underfill glue continues to grow. The global underfill market size in 2022 will be approximately US$610 million, a year-on-year growth of 8.9%.

At present, the major global underfill manufacturers include Henkel of Germany, AIM Solder of the United States, ZYMET of the United States, MacDermid of the United States, Showa Denko of Japan, Panasonic of Japan, Sanbon of Japan, Fuji Chemical of Japan, Shin-Etsu of Japan and other international enterprises, as well as Dongguan Yaju Electronics, Shenzhen Sanlue Industrial, Shenzhen Kutech Electronics, Hubei Dinglong Holdings, Guangdong Danbang Technology, Yantai Debang Technology, Beijing Tianshan New Materials, Suzhou Tianmai Thermal Technology, Dongguan Youbang Materials, Guangdong Deju Technology and other Chinese companies, number of companies numerous.

From the perspective of the domestic market, in recent years, as the global semiconductor industry has continued to shift to China, my country has become one of the world’s leading producers of electronic products, which in turn has driven the continued growth of the market demand for underfill glue. Driven by the growth in demand, my country’s underfill rubber production enterprises continue to increase and production capacity continues to improve, and it has gradually become one of the major producers of underfill rubber in the world.

Industry analysts said that underfill adhesive is an important type of electronic adhesive for integrated circuit packaging. It is widely used in the production of high-end electronic products such as mobile phones, computer motherboards, MP4s, and digital cameras. With the rapid development of the downstream market, domestic demand for underfill glue continues to increase. At the same time, against the backdrop of the booming development of the semiconductor industry, my country has gradually become one of the major producers of underfill glue in the world, and the overall development trend of the industry is improving.