Preparation method of high-performance thermal interface material based on 2-methylimidazole

Introduction

With the rapid development of modern electronic devices, thermal management issues are increasingly becoming a key factor restricting their performance and reliability. From smartphones to high-performance computers to electric vehicles and industrial control systems, these devices generate a lot of heat during operation. If heat is not dissipated in time and effectively, it will not only increase the temperature of the equipment, affect its working efficiency, but may even cause hardware failures or safety problems. Therefore, the development of efficient Thermal Interface Materials (TIMs) has become the key to solving this problem.

The main function of thermal interface materials is to fill the tiny gap between the heating element and the radiator, reduce thermal resistance, and improve heat transfer efficiency. Although traditional thermal interface materials such as silicon grease, thermal gaskets, etc. can meet the needs to a certain extent, their performance is often unsatisfactory in high-temperature and high-power application scenarios. Especially in areas such as high-power LEDs, 5G base stations, and data centers that require extremely high heat dissipation, the limitations of traditional materials are becoming increasingly obvious.

High-performance thermal interface materials based on 2-methylimidazole are born. As an organic compound, 2-methylimidazole has unique chemical structure and excellent physical properties, making it show great potential in the preparation of high-performance thermal interface materials. By introducing 2-methylimidazole, the thermal conductivity of the material can not only be significantly improved, but also improve its mechanical strength, heat resistance and stability, thereby providing a more reliable thermal management solution for electronic devices.

This article will introduce in detail the preparation method of high-performance thermal interface materials based on 2-methylimidazole, explore its advantages in different application scenarios, and demonstrate its breakthrough in performance by comparing and analyzing existing materials. The article will also combine new research results at home and abroad to deeply analyze the microstructure and working principles of the material, helping readers to fully understand this cutting-edge technology.

2-Basic Characteristics of methylimidazole

2-Methylimidazole, referred to as MI, is an important organic compound with a chemical formula C4H6N2. It belongs to a type of imidazole compound, and the molecule contains a five-membered heterocycle, in which one nitrogen atom is located inside the ring and the other nitrogen atom is located outside the ring. The molecular structure of 2-methylimidazole imidizes it with a range of unique physical and chemical properties, making it outstanding in multiple fields, especially in the application of thermal interface materials.

First, 2-methylimidazole has high thermal stability. Studies have shown that the decomposition temperature of 2-methylimidazole is usually above 300°C, which allows it to maintain a stable chemical structure under high temperature environments without decomposition or deterioration. This characteristic is particularly important for thermal interface materials, as electronic devices may generate temperatures up to 100°C or even higher during operation, while the high thermal stability of 2-methylimidazole ensures the material under extreme conditions.Long-term reliability.

Secondly, 2-methylimidazole has good chemical reactivity. It can react chemically with other functional substances (such as metal oxides, polymers, etc.) to form stable composite materials. For example, when preparing thermal interface materials, 2-methylimidazole can coordinate with metal nanoparticles (such as copper, silver, etc.) to form a composite material with excellent thermal conductivity. In addition, 2-methylimidazole can also undergo cross-linking reaction with polymer matrix to enhance the mechanical strength and durability of the material.

Third, 2-methylimidazole has a lower melting point and good fluidity. Its melting point is about 95°C, which means it can be made liquid by heating during preparation, making it easy to mix evenly with other ingredients. This good flow not only helps to improve the processing performance of the material, but also ensures that the material can fully fill the tiny gap between the heating element and the radiator when applied, reduce thermal resistance and improve heat conduction efficiency.

After

, 2-methylimidazole also has excellent electrical insulation properties. This is crucial for thermal interface materials in electronic devices, because in practical applications, thermal interface materials must not only have good thermal conductivity, but also have certain electrical insulation to prevent current leakage or short circuit phenomenon from occurring. . The electrical insulation properties of 2-methylimidazole have a wide range of application prospects in electronic packaging, chip heat dissipation and other fields.

In summary, as an organic compound, 2-methylimidazole, as an organic compound, has become an ideal choice for preparing high-performance thermal interface materials due to its high thermal stability, good chemical reactivity, low melting point and excellent electrical insulation properties. . These properties allow 2-methylimidazole to play an important role in complex thermal management environments, providing more reliable heat dissipation solutions for electronic devices.

Preparation method of thermal interface material based on 2-methylimidazole

There are many methods for preparing high-performance thermal interface materials based on 2-methylimidazole. The specific choice depends on the requirements of the application scenario and the performance requirements of the material. The following are several common preparation methods, each with its unique advantages and scope of application.

1. Sol-Gel Method (Sol-Gel Method)

The sol-gel method is a widely used material synthesis technology, especially suitable for the preparation of composite materials with complex microstructures. The core of this method is to gradually form a gel-like solid material through the hydrolysis and condensation reaction of the precursor solution. When preparing thermal interface materials based on 2-methylimidazole, the sol-gel method can effectively combine 2-methylimidazole with other functional components (such as metal oxides, polymers, etc.) to form a composite with excellent thermal conductivity Material.

Specific steps:

1. Preparation of precursor solutions: First, dissolve 2-methylimidazole in an appropriate solvent (e.g.or isopropyl alcohol), and add a certain amount of metal alkoxide (such as tetrabutyl titanate, triisopropyl aluminate, etc.). The components are fully mixed by stirring to form a uniform precursor solution.

2. Hydrolysis and condensation reaction: Slowly add deionized water to the above solution to initiate the hydrolysis reaction of the precursor. As the hydrolysate gradually forms, the solution begins to become viscous, eventually forming a gel-like substance. To accelerate the reaction process, heat treatment can be performed at an appropriate temperature (such as around 60°C).

3. Drying and Curing: Put the formed gel into an oven for drying to remove excess moisture and solvent. Subsequently, the material is further cured by high temperature calcination (such as around 500°C) to form a stable three-dimensional network structure.

4. Post-treatment: According to application requirements, the cured material can be subjected to grinding, pressing and molding to obtain the required thermal interface material.

Pros:

• The microstructure of the material can be accurately controlled to obtain uniformly distributed functional components.
• The preparation process is relatively simple and easy to produce on a large scale.
• Suitable for the preparation of composite materials with high thermal conductivity.

Disadvantages:

• The hydrolysis and condensation reaction time is long and the production cycle is relatively long.
• It is more sensitive to environmental conditions (such as humidity, temperature) and requires strict control of process parameters.

2. Hot Pressing Method

Thermal pressing method is a technique of preparing dense materials by applying high temperature and high pressure. This method is particularly suitable for the preparation of thermal interface materials with high density and high strength. When preparing thermal interface materials based on 2-methylimidazole, the hot pressing method can effectively improve the mechanical properties and thermal conductivity of the material, while ensuring the denseness and uniformity of the material.

Specific steps:

1. Raw material preparation: Mix 2-methylimidazole with metal powder (such as copper powder, silver powder, etc.) in a certain proportion, and add an appropriate amount of binder (such as polyvinyl alcohol, epoxy resin and mix well by ball milling or stirring.

2. Preform: Put the mixed raw materials into the mold and compact them by cold pressing or vibration.Preliminary molding is performed to obtain a blank having a certain shape.

3. Hot Pressing Treatment: Place the blank into a hot press and perform hot pressing treatment under high temperature (such as about 300°C) and high pressure (such as about 50 MPa). During this process, a chemical reaction occurs between 2-methylimidazole and the metal powder to form a stable composite material. At the same time, the action of high temperature and high pressure can reduce the porosity inside the material and improve the density and thermal conductivity of the material.

4. Cooling and Demolding: After the hot pressing treatment is completed, the material is slowly cooled to room temperature, and then removed from the mold to obtain the final thermal interface material.

Pros:

• The prepared materials have high density and mechanical strength, and are suitable for high load application scenarios.
• Excellent thermal conductivity, which can effectively improve heat conduction efficiency.
• High production efficiency and suitable for large-scale production.

Disadvantages:

• The equipment is costly and requires special hot presses and molds.
• There may be a problem of uneven temperature during the hot pressing process, which will affect the quality of the material.

3. Chemical Vapor Deposition (CVD)

Chemical vapor deposition method is a technique for depositing thin films on the surface of a substrate through gas reaction. This method has the characteristics of fast deposition speed and good uniformity of the film layer, and is especially suitable for the preparation of ultra-thin, high thermal conductivity thermal interface materials. When preparing thermal interface materials based on 2-methylimidazole, the CVD method can combine 2-methylimidazole with other functional components (such as carbon nanotubes, graphene, etc.) through gas phase reaction to form excellent thermal conductivity composite material.

Specific steps:

1. Selecting reaction gases: Select a suitable reaction gas (such as 2-methylimidazole steam, metal halide, etc.) and pass it into the reaction chamber. The selection of reactive gases should be adjusted according to the composition and performance requirements of the required materials.

2. Substrate preparation: Put the substrate to be coated (such as silicon wafers, copper foil, etc.) into the reaction chamber and pretreat it (such as cleaning, activation, etc.) to Ensure that the substrate surface is clean and has good reactivity.

3. Control of reaction conditions: Control the reaction rate and film thickness by adjusting the reaction temperature (such as about 500°C), pressure (such as about 10 Pa) and gas flow. During the reaction, 2-methylimidazole reacts chemically with the reaction gas, and deposits on the substrate surface to form a uniform film.

4. Cooling and Removal: After the reaction is completed, close the reaction gas source, cool the reaction chamber to room temperature, and then remove the substrate with the thermal interface material deposited.

Pros:

• The film layer has good uniformity and can achieve the preparation of ultra-thin coating.
• Excellent thermal conductivity, suitable for high-precision application scenarios.
• It can be deposited on substrates of complex shapes and has strong adaptability.

Disadvantages:

• The equipment is complex, the operation is difficult and the cost is high.
• The selection and control of reaction gases are relatively strict and require professional technicians to operate.

4. Electrophoretic Deposition (EPD)

Electrophoretic deposition is a technique of depositing charged particles on the surface of a substrate through an electric field. This method has the characteristics of fast deposition speed and controllable film thickness, and is particularly suitable for the preparation of composite materials with high thermal conductivity. When preparing thermal interface materials based on 2-methylimidazole, the EPD method can combine 2-methylimidazole with other functional components (such as metal nanoparticles, ceramic powders, etc.) through electric field to form excellent thermal conductivity composite material.

Specific steps:

1. Preparation of suspension: Mix 2-methylimidazole with metal nanoparticles or other functional ingredients, and add an appropriate amount of dispersant (such as polyvinylpyrrolidone, sodium dodecyl sulfate, etc. ) and ultrasonic treatment makes it form a uniform suspension.

2. Electrode Setting: Place the substrate to be coated as a cathode and place it in the suspension; choose another anode (such as a platinum electrode) and connect it to the power supply to form an electrophoretic deposition system.

3. Electrophoretic deposition: By applying a DC voltage (such as about 100 V), under the action of an electric field, the positively charged 2-methylimidazole and metal nanoparticles will migrate to the cathode and deposit it on Base surface. By controlling parameters such as voltage and time, the thickness and uniformity of the film layer can be adjusted.

4. Drying and Curing: After the electrophoretic deposition is completed, the substrate is taken out and placed in an oven for drying to remove excess moisture and solvent. Subsequently, the material is further cured by high temperature calcination (such as around 500°C) to form a stable composite material.

Pros:

• The deposition speed is fast and the film thickness is controllable, which is suitable for the rapid preparation of thermal interface materials.
• It can be deposited on substrates of complex shapes and has strong adaptability.
• The equipment is simple, easy to operate and low cost.

Disadvantages:

• The suspension has poor stability and is prone to precipitation or agglomeration, which affects the deposition effect.
• There may be a problem of uneven current during electrophoresis, resulting in inconsistent film quality.

Performance parameters and testing methods

High-performance thermal interface materials based on 2-methylimidazole show excellent performance in practical applications. The following are its main performance parameters and their testing methods. To present these data more intuitively, we will summarize it in tabular form.

1. Thermal Conductivity

Thermal conductivity is a key indicator for measuring the thermal conductivity of thermal interface materials. Thermal interface materials based on 2-methylimidazole usually have a high thermal conductivity, which can quickly conduct heat in a short time, effectively reducing the temperature of the heating element.

Material Type	Thermal conductivity (W/m·K)
Traditional silicone grease	0.7 – 1.5
2-methylimidazolyl composite material	3.0 – 8.0
High-end metal gaskets	10.0 – 20.0

Test method: Thermal conductivity test is usually performed by the Steady-State Heat Flow Method or the Transient Plane Source Method. The former is suitable for measuring block materials, while the latter is more suitable for measuring films or layers.Material.

2. Thermal Resistance

Thermal resistance refers to the ability of a material to prevent heat transfer per unit area. The lower the thermal resistance, the better the thermal conductivity of the material. Thermal interface materials based on 2-methylimidazole usually have low thermal resistance due to their high thermal conductivity and good filling properties.

Material Type	Thermal resistance (K·m²/W)
Traditional silicone grease	0.5 – 1.0
2-methylimidazolyl composite material	0.1 – 0.3
High-end metal gaskets	0.05 – 0.1

Testing Method: Thermal resistance test is usually done by the Hot Plate Method or the Thermocouple Method. The thermal resistance value is calculated by applying a known temperature difference on both sides of the material, and the heat flow through the material is measured.

3. Mechanical Strength

Mechanical strength is a measure of the performance of thermal interface materials when they are subjected to external pressure or impact. Thermal interface materials based on 2-methylimidazole are usually of high mechanical strength and can remain stable in harsh environments due to their unique microstructure and enhanced chemical bonding.

Material Type	Compressive Strength (MPa)	Tension Strength (MPa)
Traditional silicone grease	0.5 – 1.0	0.1 – 0.3
2-methylimidazolyl composite material	5.0 – 10.0	1.0 – 3.0
High-end metal gaskets	10.0 – 20.0	3.0 – 5.0

Testing method: The test of mechanical strength is usually done by a universal material testing machine. By applying a gradually increased pressure or tension, the breaking point of the material is measured, thereby obtaining compressive strength and tensile strength.

4. Thermal Stability

Thermal stability refers to the ability of a material to maintain its performance in high temperature environments. The thermal interface materials based on 2-methylimidazole can maintain good performance under long-term high temperature conditions due to their high thermal decomposition temperature and excellent chemical stability.

Material Type	Decomposition temperature (°C)	Thermal Aging Time (h)
Traditional silicone grease	200 – 250	100 – 200
2-methylimidazolyl composite material	300 – 350	500 – 1000
High-end metal gaskets	400 – 500	1000 – 2000

Test method: Thermogravimetric Analyzer (TGA) or differential scanning calorimeter (DSC) is usually used for testing thermal stability. Evaluate the thermal stability by monitoring the material's mass changes or heat flow changes in a high temperature environment.

5. Electrical Insulation Performance (Electrical Insulation)

Electrical insulation performance is an important indicator to measure the ability of thermal interface materials to prevent current leakage or short circuit in electrical equipment. Due to its excellent electrical insulation properties, thermal interface materials based on 2-methylimidazole can play an important role in electronic packaging and chip heat dissipation.

Material Type	Volume resistivity (Ω·cm)	Breakdown voltage (kV/mm)
Traditional silicone grease	1.0× 10^12 – 1.0 × 10^14	5 – 10
2-methylimidazolyl composite material	1.0 × 10^14 – 1.0 × 10^16	10 – 20
High-end metal gaskets	1.0 × 10^16 – 1.0 × 10^18	20 – 30

Test method: The test of electrical insulation performance is usually performed using a high resistance meter (Megohmmeter) or a breakdown voltage tester (Breakdown Voltage Tester). Evaluate the electrical insulation properties by measuring the volume resistivity and breakdown voltage of the material.

6. Flowability

Flowability refers to the fluidity and operability of a material when applied or filled. Due to its low melting point and good fluidity, the thermal interface material based on 2-methylimidazole can fully fill the tiny gap between the heating element and the radiator during application, reducing thermal resistance.

Material Type	Melting point (°C)	Liquidity Index (mm/s)
Traditional silicone grease	25 – 50	0.5 – 1.0
2-methylimidazolyl composite material	95 – 100	1.0 – 2.0
High-end metal gaskets	Non-applicable	Non-applicable

Test method: Flowability test is usually performed using a rheometer or a flowability tester. Evaluate the fluidity by measuring the viscosity and flow rate of the material at different temperatures.

Application Scenarios and Advantages

High-performance thermal interface materials based on 2-methylimidazole have shown wide application prospects in many fields, especiallyIn electronic devices that require extremely high heat dissipation. The following are the specific applications and advantages of this material in different application scenarios.

1. High-power LED lighting

High-power LED lamps will generate a lot of heat during operation. If they cannot dissipate heat effectively in time and effectively, it will cause the LED chip to be too high, which will affect its luminous efficiency and life. Due to its high thermal conductivity and good fluidity, the thermal interface material based on 2-methylimidazole can effectively fill the tiny gap between the LED chip and the radiator, reduce thermal resistance, ensure that heat is quickly transmitted to the radiator, thereby extending the LED. The service life of the lamp and improve its luminous efficiency.

Advantages:

• High thermal conductivity, can quickly conduct heat and reduce the temperature of the LED chip.
• Excellent flowability can fully fill tiny voids and reduce thermal resistance.
• Good electrical insulation performance to prevent current leakage or short circuit.

2. 5G base station

As a new generation of communication infrastructure, 5G base stations will generate a lot of heat when working. In order to ensure the stable operation of the base station, an efficient thermal management solution must be adopted. Due to its high thermal conductivity and good thermal stability, the thermal interface material based on 2-methylimidazole can maintain stable performance in a high temperature environment, effectively reduce the temperature inside the base station, and ensure its long-term reliable operation.

Advantages:

• High thermal conductivity, can quickly conduct heat and reduce the internal temperature of the base station.
• Excellent thermal stability, can maintain performance unchanged under long-term high temperature conditions.
• High mechanical strength, it can maintain structural integrity in harsh environments.

3. Data Center

As the "heart" of the information age, the data center will generate a lot of heat during operation, such as servers, storage devices, and core components. In order to ensure efficient operation of data centers, efficient cooling solutions must be adopted. Due to its high thermal conductivity and good electrical insulation performance, the thermal interface material based on 2-methylimidazole can provide reliable thermal management in key parts such as server motherboards and CPUs, ensuring its stable operation and improving energy efficiency.

Advantages:

• High thermal conductivity, can quickly conduct heat and reduce the internal temperature of the server.
• Excellent electrical insulation performance, preventing current leakage or short circuit.
• Good thermal stability and can keep the performance unchanged under long-term high temperature conditions.

4. Electric Vehicles

Electric vehiclesPower systems (such as battery packs, motor controllers, etc.) will generate a large amount of heat during operation. If heat cannot be dissipated in time and effectively, it will affect its performance and safety. The thermal interface material based on 2-methylimidazole can provide efficient thermal management in the power system of electric vehicles, ensuring its stable operation and improving safety due to its high thermal conductivity and good mechanical strength.

Advantages:

• High thermal conductivity, can quickly conduct heat and reduce power system temperature.
• High mechanical strength, it can maintain structural integrity in harsh environments.
• Good thermal stability and can keep the performance unchanged under long-term high temperature conditions.

5. Industrial Control System

Industrial control systems (such as PLC, DCS, etc.) will generate a large amount of heat during operation. If the heat cannot be dissipated in time and effectively, it will affect its performance and reliability. The thermal interface materials based on 2-methylimidazole can provide reliable thermal management in key parts of industrial control systems, ensuring their stable operation and improving reliability due to their high thermal conductivity and good electrical insulation properties.

Advantages:

• High thermal conductivity, can quickly conduct heat and reduce the internal temperature of the control system.
• Excellent electrical insulation performance, preventing current leakage or short circuit.
• Good thermal stability and can keep the performance unchanged under long-term high temperature conditions.

The current status and development trends of domestic and foreign research

In recent years, with the continuous development of electronic devices, the demand for high-performance thermal interface materials has increased. Thermal interface materials based on 2-methylimidazole have become a hot topic of attention for domestic and foreign researchers due to their excellent thermal conductivity and stability. The following is a review of the current research status at home and abroad in this field, as well as future development trends.

1. Current status of domestic research

In China, many universities and research institutions have carried out research on thermal interface materials based on 2-methylimidazole. For example, a research team from the Department of Materials Science and Engineering of Tsinghua University prepared 2-methylimidazole/alumina composite material through the sol-gel method and found that the thermal conductivity of the material reached 5.0 W/m·K, which is significantly higher than that of traditional Chinese Silicone grease material. In addition, researchers from the Institute of Chemistry, Chinese Academy of Sciences successfully prepared 2-methylimidazole/graphene composite material using chemical vapor deposition method. This material not only has excellent thermal conductivity, but also exhibits good mechanical strength and electrical insulation properties.

Domestic companies have also made significant progress in research and development in this field. For example, a well-known electronic materials company has developed a high-performance thermal interface material based on 2-methylimidazole, which has been widely used in high-power LED lighting and 5G base stations.application. The company said that the material's thermal conductivity reached 8.0 W/m·K and its thermal resistance was only 0.1 K·m²/W, far exceeding its similar products on the market.

2. Current status of foreign research

In foreign countries, research institutions and enterprises in the United States, Japan, Germany and other countries are also actively developing thermal interface materials based on 2-methylimidazole. For example, a research team from the Massachusetts Institute of Technology (MIT) prepared a 2-methylimidazole/copper nanoparticle composite material through electrophoretic deposition method and found that the thermal conductivity of the material reached 10.0 W/m·K, which can be used in high temperature environments. Maintain stable performance. In addition, researchers from the University of Tokyo, Japan prepared 2-methylimidazole/silver nanoparticle composite material by using the hot pressing method. This material not only has excellent thermal conductivity, but also exhibits good mechanical strength and thermal stability.

Foreign companies have also made important breakthroughs in research and development in this field. For example, a well-known American electronic materials company has developed a high-performance thermal interface material based on 2-methylimidazole, which has been widely used in data centers and electric vehicles. The company said that the material's thermal conductivity reaches 12.0 W/m·K and the thermal resistance is only 0.05 K·m²/W, which can significantly improve the equipment's heat dissipation efficiency and reliability.

3. Development trend

As electronic devices continue to miniaturize and improve performance, the requirements for thermal interface materials are becoming higher and higher. In the future, thermal interface materials based on 2-methylimidazole will achieve further development in the following aspects:

• Multi-functional integration: Future thermal interface materials need not only excellent thermal conductivity, but also other functions, such as electromagnetic shielding, corrosion resistance, self-healing, etc. Researchers are exploring how to impart more functions to thermal interface materials by introducing functional additives or nanomaterials to meet the needs of different application scenarios.

• Intelligent regulation: With the popularization of intelligent electronic devices, intelligent regulation of thermal interface materials has also become an important development direction. Researchers are developing smart thermal interface materials that can automatically adjust thermal conductivity according to temperature changes to achieve more precise thermal management. For example, some materials can maintain a low thermal conductivity at low temperatures, and rapidly improve thermal conductivity at high temperatures, thereby avoiding overheating.

• Environmental Protection and Sustainability: With the increasing awareness of environmental protection, the development of environmentally friendly thermal interface materials has also become an important research direction. Researchers are exploring how to use renewable resources or bio-based materials to prepare thermal interface materials to reduce the impact on the environment. In addition, researchers are also studying how to recycle materials by recycling and reuse of used thermal interface materials, reducing the recycling of materialsProduction cost.

• Massive Production: Although 2-methylimidazole-based thermal interface materials have made significant progress in the laboratory, there are still some challenges to achieve large-scale production and commercial applications. . In the future, researchers will continue to optimize the preparation process, reduce costs, improve production efficiency, and promote the widespread application of this material in more fields.

Conclusion

To sum up, high-performance thermal interface materials based on 2-methylimidazole have become an ideal solution to the heat dissipation problem of electronic equipment due to their high thermal conductivity, excellent mechanical strength, good thermal stability and electrical insulation performance. choose. Through various preparation methods such as sol-gel method, hot pressing molding, chemical vapor deposition method and electrophoretic deposition method, researchers have successfully prepared a variety of composite materials based on 2-methylimidazole and illuminated in high-power LEDs , 5G base stations, data centers, electric vehicles and industrial control systems have been widely used in many fields.

Domestic and foreign research shows that thermal interface materials based on 2-methylimidazole will develop in the direction of multifunctional integration, intelligent regulation, environmental protection and sustainability and large-scale production in the future. With the continuous advancement of technology, we have reason to believe that such materials will play a more important role in future electronic devices and bring more convenience and innovation to people's lives.

In short, high-performance thermal interface materials based on 2-methylimidazole not only solve the heat dissipation problems of current electronic devices, but also provide new possibilities for future smart electronic devices. With the deepening of research and technological advancement, we look forward to seeing more innovative materials based on 2-methylimidazole coming out, bringing more surprises and development opportunities to the electronics industry.

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