Granular epoxy molding compound (GMC) is in strong demand in the field of semiconductor packaging. Huahai Chengke is a leading company in my country

Epoxy molding compound is a thermosetting chemical material processed with epoxy resin as the matrix and phenolic resin as the curing agent. According to different forms, epoxy molding compound can be divided into liquid epoxy molding compound (LMC). and granular epoxy molding compound (GMC). Granular epoxy molding compound has the advantages of low thermal expansion coefficient and good processability, and has broad application prospects in the field of semiconductor packaging.

The traditional preparation method of granular epoxy plastic sealing materials has the disadvantages of poor quality of finished products and long preparation cycle, and is not suitable for large-scale production. Thermal cutting method and centrifugal method are emerging methods for preparing granular epoxy plastic sealing materials. The above two methods have extremely high requirements on equipment quality, control parameters, etc. my country’s granular epoxy plastic sealing compound industry started late, and its core technology has been monopolized by overseas developed countries for a long time, resulting in high reliance on imports for demand. In recent years, with the improvement of independent research and development capabilities of local enterprises, the localization process of my country’s granular epoxy plastic sealing compound market has accelerated.

The main raw materials of granular epoxy plastic sealing compound are epoxy resin and phenolic resin. After years of development, my country has become a major producer of epoxy resin and phenolic resin, and the market share of high-quality products continues to increase. Taking phenolic resin as an example, my country’s phenolic resin output will reach nearly 2 million tons in 2022, setting a record high. The sufficient supply of raw materials provides favorable conditions for the development of my country’s granular epoxy plastic sealing compound industry.

According to the “2023-2028 China Granular Epoxy Molding Compound (GMC) Industry Market In-depth Research and Development Prospects Forecast Report》 shows that granular epoxy plastic packaging materials are mainly used in the field of semiconductor packaging, including system-level packaging (SiP) and fan-out wafer-level packaging (FOWLP). In recent years, FOWLP packaging technology has gradually become one of the research hotspots in the global semiconductor packaging field. It has the characteristics of high performance and low cost, and is widely used in the field of high-density fan-out packaging. In the future, as the application scope of FOWLP packaging technology continues to expand, the market demand for granular epoxy plastic sealants will further grow.

Japan is the world’s largest producer of granular epoxy plastic sealing materials. Its representative companies include Japan’s Sumitomo Bakelite Co., Ltd. (Sumitomo) and Japan’s Esti Electrical Materials Company (SHOWADENKO). In terms of the local market, Huahai Chengke is the only listed company in my country with independent research and development capabilities for granular epoxy plastic sealants. Its products are currently in the sample delivery stage and will be used in high-bandwidth memory (HBM) packaging in the future.

Industry analysts said that granular epoxy plastic sealants have broad application prospects in the field of semiconductor packaging. In the future, with the growth of downstream demand, its The speed of industry development will further accelerate. Compared with overseas developed countries, my country’s granular epoxy plastic sealing compound industry started late and its technical level is relatively backward. In the future, with the improvement of independent research and development capabilities of local enterprises, the market share of domestically produced granular epoxy plastic sealants will increase.