The application demand for CMP polishing pads (CMP polishing pads) is increasing day by day. The process of localization in the Chinese market is accelerating.

CMP polishing pad, also known as CMP polishing pad and chemical mechanical planarization polishing pad, refers to a consumable that physically and mechanically polishes the wafer surface and removes impurities in CMP technology. CMP polishing pads are usually disc-shaped in appearance and need to be used in conjunction with CMP diamond discs to achieve flat polishing of the wafer surface.

There are many types of CMP polishing pads. According to different material structures, they can be divided into non-woven polishing pads with velvet structure, non-woven polishing pads, composite polishing pads and polymer polishing pads. Polymer polishing pads refer to polishing pads made of rigid porous polyurethane foam. Polymer polishing pads have the advantages of strong wear resistance, high tear resistance, and good corrosion resistance, and are the representative products of CMP polishing pads. The composite polishing pad is composed of a polishing layer and a buffer layer. It has the advantages of long service life and high polishing efficiency, and improves the shortcomings of other CMP polishing pads that are easy to glaze.

According to the “2023-2028 China CMP Polishing Pad (CMP Polishing Pad) Industry Market In-depth Research and Development Prospects Forecast Report span>》shows that CMP polishing is an important link in wafer manufacturing and plays a decisive role in its performance and quality. CMP polishing pads are CMP polishing materials, accounting for nearly 30% of their production costs. In 2022, my country’s CMP polishing materials market will reach US$690 million, a year-on-year growth of 9.7%. CMP polishing pads are mainly used for mechanical polishing of wafers. With the rapid expansion of wafer production capacity and the increasing number of wafer foundries in my country, the demand for CMP polishing pad applications is becoming increasingly strong. In 2022, its market size will increase by 12.6% year-on-year.

Representative companies of global CMP polishing pads include The Dow Chemical Company (DOW), Dupont, C-Carbot, TOYO TIRE & RUBBER, and Toray Industries Club (TORAY), etc. Dow Chemical is the world’s largest manufacturer of CMP polishing pads, accounting for nearly 80% of the market.

Compared with overseas developed countries, my country’s CMP polishing pad industry started late. Restricted by factors such as high technical barriers and high production costs, demand is highly dependent on imports. In recent years, with the continuous expansion of my country’s 8-inch wafer production, the prosperity of the CMP polishing pad industry has further improved, attracting many companies to lay out their R&D and production tracks, and driving the process of domestic substitution in the market to continue to accelerate. Dinglong Co., Ltd., SMIC, Xingsi Technology, Wanhua Chemical, Hongguang Grinding, etc. are the main manufacturers of CMP polishing pads in my country. Dinghui Microelectronics, a subsidiary of Dinglong Co., Ltd., has independent research and development capabilities for CMP polishing pads.

​​  Industry analysts said that as an important consumable for CMP technology, CMP polishing pads are rich in types and have good application prospects. With the accelerated development of my country’s wafer industry, the market demand for CMP polishing pads will further grow. But at present, my country’s CMP polishing pad industry is still in its infancy, and demand is highly dependent on imports. In the future, as local companies improve their independent research and development capabilities, the localization process of my country’s CMP polishing pad market will accelerate.