The market demand for low-pressure molding hot-melt adhesives is vast. In the future, local companies will need to accelerate their efforts to improve their competitiveness.

author: Post: 11/22/2023 20read Comments Off

Low-pressure molding refers to a process in which packaging materials are injected into the mold through low injection pressure (2-20bar) and rapidly solidified. It is a method between high-pressure injection molding and potting. Low-pressure molding hot melt adhesive (low-pressure injection molding hot melt adhesive) is a hot melt adhesive product produced using a low-pressure molding process. Compared with ordinary hot melt adhesive products, it has better temperature resistance, weather resistance, sealing, and electrical insulation. , anti-corrosion, impact resistance and other properties, it can meet the packaging and protection requirements of high-precision electronics and sensitive electronic components, and the market development space is broad. According to different raw materials, low-pressure molding hot melt adhesive can be divided into low-pressure molding polyamide hot melt adhesive and low-pressure molding polyolefin hot melt adhesive.

Under the background of the booming development of the domestic new energy automobile industry, low-pressure molding hot melt adhesive, as a new material that can meet the needs of high durability, high stability and lightweight for automotive electronics and parts, has ushered in a period of development opportunities for the industry. At present, low-pressure molding hot melt adhesive has been widely used in automotive wiring harness packaging, waterproof connectors, sensors, micro switches, power supplies, plug packaging, and ECU (internal PCB) packaging scenarios. With the scale of domestic new energy vehicle production and sales It continues to expand and its market develops rapidly.

According to data from the China Automobile Association, my country’s new energy vehicle production and sales in 2022 will be 7.058 million and 6.887 million respectively, a year-on-year increase of 96.9% and 93.4%. In this context, according to the “Monitoring and Future Development of China’s Low-Pressure Molding Hot Melt Adhesive Industry from 2023 to 2027” released by the Industrial Research Center Prospect Research Report shows that the domestic low-pressure molding hot melt adhesive market will be approximately 420 million yuan in 2022, a year-on-year increase of 8.5%. Against the background of the rapid development of the national economy, my country has now become the world’s major consumer of low-pressure molding hot melt adhesives, with broad market demand.

Due to technical limitations, my country’s low-pressure molding hot melt adhesive market is still dominated by leading foreign companies such as Henkel of Germany, Arkema of France, and Huntsman of the United States, and the level of localization is low. Domestic companies with mass production capabilities for low-pressure molding hot-melt adhesives mainly include Guangdong Sainty New Materials, Guangzhou Aoshen Polymer, Shanghai Huanyang Chemical Technology, Guangzhou Yanruode New Materials, etc. Local companies are in line with them in terms of technology and product performance. There is a big gap between international companies.

Industry analysts said that low-pressure molding hot melt adhesive is a new type of hot melt adhesive produced using advanced low-pressure injection molding technology. The material has the advantage of higher comprehensive performance, can be applied to a variety of high-precision and sensitive electronic packaging and protection scenarios, and has broad application prospects. At present, many companies in my country have the capacity to mass-produce low-pressure molding hot-melt adhesives. However, there is a large gap between domestic products and internationally advanced products. In the future, companies will need to accelerate the improvement of their technical level and product research and development capabilities. There is huge room for industry growth.